Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Market Research Report: Market Analysis on the Future Growth Prospects and Market Trends Adopted by the Competitors, Regions with Forecast by 2023

(IT-NEWSWIRE.COM, September 07, 2018 ) High Bandwidth Memory (HBM) is a high-performance RAM interface for 3D-stacked DRAM from AMD and Hynix. It is to be used in conjunction with high-performance graphics accelerators and network devices. Hybrid Memory Cube (HMC) is a high-performance RAM interface for through-silicon vias (TSV)-based stacked DRAM memory competing with the incompatible rival interface High Bandwidth Memory (HBM).

In terms of geographic regions, APAC is expected to grow at the highest CAGR during the forecast period. The major drivers for the rapid growth of the HMC and HBM market in APAC are the growing number of data centers and servers, increasing shipments of network equipment, and the rising number of manufacturing activities in the enterprise storage and consumer electronics sectors. The strong economic growth and growing demand for high-density memories is expected to drive the HMC and HBM market in the APAC region.

Over the next five years, LPI(LP Information) projects that Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

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This report presents a comprehensive overview, market shares, and growth opportunities of Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market by product type, application, key manufacturers and key regions.

To calculate the market size, Publisher considers value and volume generated from the sales of the following segments:

Segmentation by product type:
Hybrid Memory Cube (HMC)
High-bandwidth memory (HBM)

Segmentation by application:
Graphics
High-performance Computing
Networking
Data Centers

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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Micron
Samsung
SK Hynix
Advanced Micro Devices
Intel
Xilinx
Fujitsu
Nvidia
IBM
Open-Silicon
Cadence
Marvell

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Some Points From Table of Content:
1 Scope of the Report
2 Executive Summary
3 Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) by Players
4 Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) by Regions
5 Americas
6 APAC
7 Europe
Continued…

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Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Market Research Report: Market Analysis on the Future Growth Prospects and Market Trends Adopted by the Competitors, Regions with Forecast by 2023