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(IT-NEWSWIRE.COM, July 28, 2018 ) This report studies the Global Fan-out Wafer Level Packaging Market size, industry status and forecast, competition landscape and growth opportunity. This research report categorizes the global Fan-out Wafer Level Packaging market by companies, region, type and end-use industry.
FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer.
In terms of geography, APAC led the global FOWLP market. According to analysts, the region will continue to dominate this market during the forecast period as well and this will mainly attribute to the presence of major semiconductor industries in the region.
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In 2017, the global Fan-out Wafer Level Packaging market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2018-2025.
Top players in Global Fan-out Wafer Level Packaging market:
STATS ChipPAC
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
STMicroelectronics
Ultratech
Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Market segment by Type, the product can be split into
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other
Market segment by Application, split into
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other
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The study objectives of this report are:
To study and forecast the market size of Fan-out Wafer Level Packaging in global market.
To analyze the global key players, SWOT analysis, value and global market share for top players.
To define, describe and forecast the market by type, end use and region.
To analyze and compare the market status and forecast between China and major regions, namely, United States, Europe, China, Japan, Southeast Asia, India and Rest of World.
To analyze the global key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
To strategically profile the key players and comprehensively analyze their growth strategies.
Some Points from Tables of Content:
Chapter One: Industry Overview of Fan-out Wafer Level Packaging
Chapter Two: Global Fan-out Wafer Level Packaging Competition Analysis by Players
Chapter Three: Company (Top Players) Profiles
Chapter Four: Global Fan-out Wafer Level Packaging Market Size by Type and Application (2013-2018)
Chapter Five: United States Fan-out Wafer Level Packaging Development Status and Outlook
Chapter Six: EU Fan-out Wafer Level Packaging Development Status and Outlook
Chapter Seven: Japan Fan-out Wafer Level Packaging Development Status and Outlook
Chapter Eight: China Fan-out Wafer Level Packaging Development Status and Outlook
Chapter Nine: India Fan-out Wafer Level Packaging Development Status and Outlook
Chapter Ten: Southeast Asia Fan-out Wafer Level Packaging Development Status and Outlook
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Hector Costello
+1 (214) 884-6817
sales@orbisresearch.com
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