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(IT-NEWSWIRE.COM, March 14, 2019 ) LTCC Ceramic Substrates is a type of multilayer ceramic substrate that made by lower temperature (usually from 850 to 900?) firing process than general ceramic firing process by adding glass to alumina. It makes it possible to use low resistive conductor as conductor patterns in.
Currently, the LTCC Ceramic Substrates industry concentration is relatively high, there are approximately sixties producers distributed in the Japan, North America, Europe and China, and the top ten producers occupy for over 53% of global LTCC Ceramic Substrates production.
Japan is the largest producer and exporter in the world, 48.57% of global LTCC Ceramic Substrates production in 2015, and the Murata, Kyocera, TDK, Taiyo Yuden, KOA Corporation and Yokowo, dominate the market for many years.
The North America is the second producer in 2015; American Technical Ceramics and NEO Tech are the two most important producers in the America, and DuPont is a very important play in the LTCC Ceramic Substrates tapes, which supplies LTCC Ceramic Substrates tapes to most of the LTCC Ceramic Substrates devices producers.
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According to this study, over the next five years the LTCC Ceramic Substrates market will register a 12.6% CAGR in terms of revenue, the global market size will reach US$ 1970 million by 2024, from US$ 960 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in LTCC Ceramic Substrates business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of LTCC Ceramic Substrates market by product type, application, key manufacturers and key regions and countries.
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Murata(JP)
Kyocera(JP)
TDK(JP)
Taiyo Yuden(JP)
KOA Corporation(JP)
Yokowo(JP)
Hitachi Metals(JP)
NIKKO(JP)
Soshin Electric(JP)
Bosch(DE)
IMST GmbH(DE)
MST(DE)
Via Electronic(DE)
Adamant(JP)
API Technologies(BE)
Selmic(FL)
VTT(FL)
American Technical Ceramics(US)
NEO Tech(US)
NTK Technologies(US)
Northrop Grumman(US)
Samsung Electro-Mechanics(KR)
PILKOR CND(KR)
ACX Corp(TW)
Yageo(TW)
Walsin Technology(TW)
Darfon Materials(TW)
Elit Fine Ceramics(TW)
Sunlord(CN)
CETC 43rd Institute(CN)
CNIGC 214th Institute(CN)
ChengDian Electronic(CN)
Microgate(CN)
Fenghua Advanced Technology(CN)
Browse Complete Report@ https://www.orbisresearch.com/reports/index/global-ltcc-ceramic-substrates-market-growth-2019-2024
This study considers the LTCC Ceramic Substrates value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Chip Scale Package (CSP) LTCC Substrates
Modules LTCC Substrates
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Consumer Electronics
Aerospace & Military
Automobile Electronics
Others
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Table of Contents:
1 Scope of the Report
2 Executive Summary
3 Global LTCC Ceramic Substrates by Players
4 LTCC Ceramic Substrates by Regions
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
…Continued
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